News Article
The Opto-device Division Of Hitachi`s Semiconductor And Integrated Circuit
The opto-device division of Hitachi's Semiconductor and Integrated Circuit
(SIC) group is to be transfered to Hitachi's OpNext subsidiary. The transfer
is anticipated to be effective October 1, 2002. The transaction will cover
the opto-device division of SIC as well as the opto-electrical device
development and manufacturing team and fabrication facilities from Hitachi
Tohbu Semiconductor.
The opto-device division of Hitachi's Semiconductor and Integrated Circuit
(SIC) group is to be transfered to Hitachi's OpNext subsidiary. The transfer
is anticipated to be effective October 1, 2002. The transaction will cover
the opto-device division of SIC as well as the opto-electrical device
development and manufacturing team and fabrication facilities from Hitachi
Tohbu Semiconductor.
(SIC) group is to be transfered to Hitachi's OpNext subsidiary. The transfer
is anticipated to be effective October 1, 2002. The transaction will cover
the opto-device division of SIC as well as the opto-electrical device
development and manufacturing team and fabrication facilities from Hitachi
Tohbu Semiconductor.